Our Strengths
Manufacturing Capabilities
Surface mounting
We have equipment for applications such as surface mount technology (SMT), dual in-line packaging (DIP), bond coating, laser marking, 3D printing inspection, X-ray inspection, and BGA rework. We have built production systems that fulfill the requirements of automotive devices, and we possess extensive experience in customer audits.
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Automotive Camera
Minimum chip size: 0603
Minimum lead pitch: 0.4mm -
Keyless Entry Transmitter
Minimum chip size: 1005
Minimum lead pitch: 0.5mm -
OEM/Aftermarket AV Navigation CPU Board
Minimum chip size: 0603
Minimum lead pitch: 0.5mm -
Distance Sensor
Minimum chip size: 1005
Minimum lead pitch: 0.5mm