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Your EMS partner in making your designs come to life.

Our Strengths

Manufacturing Capabilities

Surface mounting

We have equipment for applications such as surface mount technology (SMT), dual in-line packaging (DIP), bond coating, laser marking, 3D printing inspection, X-ray inspection, and BGA rework. We have built production systems that fulfill the requirements of automotive devices, and we possess extensive experience in customer audits.

  • Automotive camera board image

    Automotive Camera

    Minimum chip size: 0603
    Minimum lead pitch: 0.4mm

  • Keyless entry transmitter board image

    Keyless Entry Transmitter

    Minimum chip size: 1005
    Minimum lead pitch: 0.5mm

  • OEM/Aftermarket AV navigation CPU board image

    OEM/Aftermarket AV Navigation CPU Board

    Minimum chip size: 0603
    Minimum lead pitch: 0.5mm

  • Distance sensor board image

    Distance Sensor

    Minimum chip size: 1005
    Minimum lead pitch: 0.5mm

Muramoto Industry Co., Ltd.