U-shaped bending and bonding

VA/VE proposals

Problem

The film sensor does not fit within the product size.

Solution

We developed a bonding method that bends the film sensor into a U-shape.

Effects

The sensor can be attached within a limited space.

Detailed description

Fitting a sensor into the limited space of a capacitive touch panel involves U-shaped bending and bonding. However, the bending process carries a risk of damage.
We explored and developed a processing method that eliminates the risk of damage from bending and the creation of air bubbles when joining curved surfaces.